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EIPC Issues Letter of Urgency

04/29/2024 | Alun Morgan, EIPC
Alun Morgan, president of EIPC, issued a letter last week in an effort to raise awareness of the state of PCB manufacturing in Europe. He writes, "The European PCB manufacturing industry and its supply base has been steadily shrinking since the dot com crash at the start of the millennium. European demand for PCBs and assemblies has, however, continued to grow, thus creating an ever-widening gap between European domestic capacity and consumption. The risks posed by this imbalanced supply and demand pattern came into sharp focus during the Covid-19 pandemic which caused chaos in extended supply chains across the world and resulted in widespread shortages."

SCHWEIZER Confirms Group Figures and Outlook for 2024

04/29/2024 | SCHWEIZER
SCHWEIZER announces the publication of the annual report for 2023 and confirms the preliminary figures. The SCHWEIZER-Group (according to IFRS) generated sales of EUR 139.4 million in 2023 (previous year: EUR 131.0 million).

VDMA: Machine Vision Navigating Through Uncertain Times

04/18/2024 | VDMA
For over a decade, the European machine vision industry has reported steady growth, with turnover increasing by an average of 9 percent annually between 2012 and 2022. Despite a temporary setback in 2020 (minus 4 percent) due to the Covid-19 pandemic, the industry rebounded strongly in 2021 (plus 17 percent) and 2022 (plus 11 percent).

Aspocomp’s Q1 Net Sales and Operating Result Decreased YoY

04/18/2024 | Aspocomp
Inflation and interest rates, weak economic development, the uncertainties posed by Russia’s war of aggression and the situation in the Middle East, and global trade policy tensions will affect the operating environment of Aspocomp and its customers in the 2024 fiscal year.

SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1

04/17/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
In this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and assembly.
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