I-007eBook Review: Thermal Management From a Fabricator’s Perspective


Reading time ( words)

The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator’s Perspective, written by Anaya Vardya, founder and CEO of American Standard Circuits, is an important book for a number of reasons. The most important reason is right there in the title; it is from the fabricator’s perspective. Besides explaining all aspects of thermal management—from thermal vias and metal-core boards to mixed technology—this book also describes the various applications of thermal dielectrics, their properties, and their incorporation into the actual fabrication of PCBs.

For those who are, shall we say, “less technical” than others, it’s refreshing—not to mention face-saving, at times—to be able to understand terms like insulated metal-clad PCBs (IMPCBs), metal-clad PCBs (MCPCBs), and mixed-technology PCBs.

TPCDG2TMFP_final_cover_RGB.jpgI found the section on thermal impedance and thermal resistance especially useful with their clear and concise definitions of what these terms actually mean. The images and descriptive charts are an integral part of this book, illustrating the properties of various thermal options. Finally, the book’s true value is describing the various processes of each type of thermal technology PCB.

The Printed Circuit Designer’s Guide to Thermal Management… A Fabricator’s Perspective is an excellent book for everyone from our industry’s newest members to the most experienced engineers and even marketing and sales professionals who need a good understanding of thermal management.

This is another great addition to I-Connect007’s library of technical micro-eBooks free for anyone to download. Download your copy today.

Dan Beaulieu is president of D.B. Management Group.

Share

Print


Suggested Items

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 3

07/01/2020 | I-Connect007 Editorial Team
The following is an excerpt from Chapter 3 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.

Ventec Book Excerpt: Thermal Management with Insulated Metal Substrates

05/28/2020 | I-Connect007 Editorial Team
The following is an excerpt from Chapter 1 of "The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.

3DEM Modeling: Influence of Metal Plating on PCB Channel Loss and Impedance

03/21/2019 | Chang Fei Yee, Keysight Technologies
This article briefly introduces different types of metal plating commonly used in PCB fabrication. Subsequently, the influence of metal plating on PCB channel loss (i.e., insertion loss or S21) and impedance (i.e., time domain reflectometry or TDR) is studied with 3DEM modeling,



Copyright © 2020 I-Connect007. All rights reserved.