-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueOpportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
Manufacturing Know-how
For this issue, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
The Impact of Inductance on Impedance of Decoupling Capacitors
August 8, 2019 | Chang Fei Yee, Keysight TechnologiesEstimated reading time: 1 minute
This article discusses the impact of interconnection inductance on the impedance of the decoupling capacitor, which influences the power integrity of the PCB. The investigation is performed with 3DEM simulation by varying the trace length and height of stitching vias that connect the decoupling capacitor across the power rail and ground.
On a PCB, a power distribution network (PDN) with low impedance across the wideband is required to transfer power with low switching noise and high stability from the supply to the digital and analog ICs. Each decoupling capacitor—together with its interconnection inductance—are the major factors that contribute to the impedance of the PDN on a PCB. As shown in the cross-sectional view of the PCB depicted in Figure 1, interconnection inductance is formed by the traces and stitching vias hooking up the decoupling capacitor across the power rail and ground (e.g., Loop 1, Loop 2, and Loop 3). This parasitic inductance is directly proportional to the stitching via height and trace length, as governed by Equations 1 and 2, respectively.
Furthermore, referring to the directly proportional relationship between impedance and interconnection inductance in Equations 3 and 4, it is crucial to keep the interconnection inductance low to minimize the impedance of the PDN, which is achievable by reducing trace length and stitching via height.
To read this entire article, which appeared in the July 2019 issue of Design007 Magazine, click here.
Suggested Items
Altair SimSolid Transforms Simulation for Electronics Industry
03/22/2024 | AltairAltair, a global leader in computational intelligence, announced the upcoming release of Altair SimSolid for electronics, bringing game-changing fast, easy, and precise multi-physics scenario exploration for electronics, from chips, PCBs, and ICs to full system design.
Wistron Uses NVIDIA Omniverse and NVIDIA Modulus
03/20/2024 | WistronWistron has utilized the NVIDIA’s Omniverse software development platform and the NVIDIA Modulus framework to create a proprietary application platform, dubbed the "Wistron Foundation APP."
Cadence to Acquire BETA CAE, Expanding into Structural Analysis
03/06/2024 | Cadence Design SystemsCadence Design Systems, Inc. announced it has entered into a definitive agreement to acquire BETA CAE Systems International AG, a leading system analysis platform provider of multi-domain, engineering simulation solutions.
Keysight, Intel Foundry Partner to Certify Electromagnetic Simulation Software for Intel 18A Process Technology
02/22/2024 | BUSINESS WIREKeysight Technologies, Inc. announces that the RFPro electromagnetic (EM) simulation software, part of the Keysight EDA Advanced Design System (ADS) integrated tool suite, is now certified by Intel Foundry for design engineers targeting Intel 18A process technology.
TRU Simulation Celebrates 10 Years of Innovation in Flight Simulation
02/16/2024 | BUSINESS WIRETRU Simulation + Training revealed that as it marks a decade of success in the aviation simulation industry, the company is rebranding to simply “TRU Simulation.”