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For the monthly Lunch ‘n Learn meeting on June 28, the Orange County chapter of the IPC Designers Council features two guest speakers with informative presentations on multiboard design and material solutions to address skew.
Presentation 1: Addressing the Challenges of Multiboard Design: Taking the “Big Picture” Approach to System Design
Speaker: Chris Carlson, CID, Senior Field Applications Engineer with Altium
As technology becomes more complex and miniaturized, the need for more complex multiboard systems arise. Clear lines between layout, mechanical and performance concerns begin to blur, which creates the need for PCB designers to take a more holistic view of the system.
In this presentation, Chris Carlson will discuss the unique and varied challenges that arise when doing multiboard system designs. He will review the considerations relative to partitioning the PCB, connection management, connector libraries and planning the layout. He will also discuss mechanical features, managing signals, thermal management, reliability, and power and signal integrity. Finally, Carlson will show how to ensure good mechanical fit by making the most of your 3D CAD functionality.
Presentation 2: Design and Manufacturing Developments to Lower Insertion Loss and Digital Pair Skew: What a Designer Needs to Know About Meeting 56Gb/S Speed Challenges
Speaker: Norm Berry, Director of Laminate and OEM Marketing, Insulectro
As frequency increases, differential pair skew and insertion loss become critical considerations for PCB design and manufacture. Add the ever-increasing complexity of reliable designs, while balancing value/cost performance, and the manufacturing options become more challenging. The designer needs to be aware of advancements in the base material manufacture and the options available to the fabricator.
Whether we are concerned with the demands of HDI designs with stacked, laser-drilled microvias or insertion loss on high-speed digital backplanes, the base material composite, with low-profile copper and a mechanically spread glass reinforcement, has a direct impact. Backplanes operating at 56Gb/s require the integration all these factors and the newly developed manufacturing technologies.
The cost is 10 at the door. Altium is sponsoring the event by helping with the cost of the lunches.
There are two ways to RSVP:
Please RSVP no later than noon on Wednesday, June 27. Reserve a spot on your calendar on Thursday, June 28 from 11:30 am to 1:30 pm for this educational Lunch ‘n Learn event.
Harvard Athletic Park (The multi-purpose room is at the SOUTH end of the athletic fields)
14701 Harvard Ave.