-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueOpportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
Manufacturing Know-how
For this issue, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Asia and South Pacific Design Automation Conference 2018
December 13, 2017 | Cadence Design Systems, Inc.Estimated reading time: Less than a minute
ASP-DAC 2018, which will be held on January 22-25, 2018 in Jeju, Korea, is the twenty-third annual international conference on VLSI design automation in Asia and South Pacific region, one of the most active regions of design and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies related to Electronic Design Automation (EDA).
As a specially recognized “Global Education Partner” by ACM SIGDA, Cadence will also sponsor the Student Research Forum at the ASP-DAC, which is renovated from a poster session for students to present their dissertation research with experts, extended to offer a great opportunityies to establish contacts for their future career. In addition, it helps companies to know the latest research and discover talents for the employment. Please join us and you will get a chance to talk with Cadence R&D leaders face to face.
For more details, click here.
Suggested Items
Arrow Electronics Launches Intelligent Vision Ecosystem
03/27/2024 | BUSINESS WIREArrow Electronics, Inc. is utilizing the onsemi Imager Access System (IAS) module standard for developing intelligent vision solutions for use in robotics, machine vision, commercial cameras and other uses.
Dymax Will Exhibit Light-Cure Solutions for Today’s Electronics at IPC APEX 2024
03/26/2024 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, will exhibit at the IPC APEX EXPO 2024 in Anaheim, CA, April 9-11.
Synopsys Announces New AI-Driven EDA, IP and Systems Design Solutions At SNUG Silicon Valley
03/25/2024 | PRNewswireSynopsys, Inc. kicked off its annual flagship Synopsys User Group (SNUG) conference in Silicon Valley at the Santa Clara Convention Center with a keynote presentation by Synopsys president and CEO Sassine Ghazi. Ghazi discussed the unprecedented innovation opportunities and challenges that technology R&D teams face in this era of pervasive intelligence.
New North American Product Family Release from Smart Factory Design
03/22/2024 | Smart Factory DesignSmart Factory Design is pleased to announce a new system technology and supply chain model for providing Zero Liquid Discharge (ZLD) Wastewater Recycling Systems to the North American market. Smart Factory Design is an international public benefit company focused on environmental sustainability and autonomous processes for the Printed Circuit Board, IC Substrate, and General Metal Finishing industries.
UHDI Fundamentals: ASC Sponsors Ultra High Density Interconnect Symposium
03/21/2024 | Anaya Vardya, American Standard CircuitsAmerican Standard Circuits (ASC) is a major sponsor of an upcoming symposium on one of the most talked about new technologies that has come along in quite a while: ultra high density interconnect (UHDI).