Reading time ( words)
The temporary or quick turn part is a reality in today’s fast-moving design process. In many cases, a search of the corporate library comes up short and you need to explore the supply chain for that perfect part. Starting a design with an unapproved or temporary part is a common occurrence in today’s design environment. This reality has forced all of us to adopt policies and procedures that allow for the use of temporary parts. The biggest challenge with temporary parts is making sure that all of the design’s components have been validated and all remnants of the temporary parts have been successfully purged or converted to an approved part.
Attendees will learn best practices for using and managing temporary parts in a design process. Watch a live demonstration using a design data management system and learn how to prevent a temporary part from slipping through the release process and into manufacturing, all while you track and manage parts throughout the design cycle.
December 6, 2017 2 pm Eastern Time
For more information or to register, click here.
Bin Zhou, EDADOC
With the development of communication and IT industries and the ever-increasing demand for information analysis, many chip makers have racked their brains trying to provide customers with better technology, such as increased computing power and storage capacity of chips as well as diversifying their product offerings.
Dr. John Parry, CEng, Mentor
When designing a PCB, thermal issues are often locked in at the point of selecting and laying out the chip package for the board. After that, only remedial actions are possible if the components are running too hot. Assumptions made about the uniformity of the airflow in these early design stages can mean a disaster for the commercial viability of a PCB if those assumptions are incorrect. A different approach is needed to improve reliability and to optimize board performance. Dr. John Parry of Mentor explains.
Andy Shaughnessy, PCB Design007
If you mention thermal management in a group of PCB designers and design engineers, Mike Jouppi’s name usually pops up. Mike is an engineer and founder of the Thermal Management LLC consulting firm. He spent years updating IPC’s charts on current-carrying capacity, which had been unchanged since the 1950s. I recently caught up with Mike and asked him to give us his views on the state of thermal management, as well as the tools and standards related to thermal design.