Polar Speedstack Si Integrates Insertion Loss Field Solver; To Exhibit at productronica


Reading time ( words)

Polar Instruments, a specialist provider of tools for PCB design, fabrication and test, announces a major enhancement for Speedstack Si at productronica. Speedstack Si 2018 edition now contains an integrated insertion loss field solver – which lets the user both design and add comprehensive insertion loss graphs and stackup specification into Speedstack’s professional report engine.

“Having a built in Polar field solver in Speedstack as well as a seamless connection to the industry standard Si9000e insertion loss solver adds significant capability for the fabricator and PCB technologist working with multi GHz designs,” explains Neil Chamberlain, Signal Integrity Product manager at Polar Instruments. “One of the key strengths of the Speedstack system is its ability to accurately document detailed specifications for each layer in a PCB stackup. By providing both graphical insertion loss data and live link to regularly updated material libraries the liaison between the design specification authority and the PCB fabricator is simplified and the communication path enhanced.”

Speedstack is part of a suite of signal integrity and documentation tools from Polar, enabling OEM PCB specifiers and fabricators to accurately communicate layer stackup and associated signal integrity requirements. Polar Impedance and Insertion loss field solvers, along with Impedance and Insertion loss test systems connect with Speedstack to close the loop between specifying, test vehicle generation, modeling and measurement.

Visit Polar at productronica 2017 Stand A1.555 or B3.138

  • Live online base material library links directly with Speedstack
  • Material data from 18 base material suppliers
  • Easy to select and download by material family
  • Simplifies initial setup –rapidly gets you up and running.
  • Quickly add newly released materials to your existing library

About Polar Instruments

Polar Instruments is a market leader in designing and manufacturing tools to simplify and enhance the design, fabrication documentation and testing of printed circuit boards (PCBs). Polar’s innovative tools include the industry standard Controlled Impedance Test System (CITS) which provides the global PCB industry with an easy to use test system for high-speed digital and RF boards, as well as class-leading tools for fast and accurate design and testing of controlled impedance in PCBs. Polar also leads the industry in tools for PCB layer stackup design and documentation. Established in 1976 Polar has operations and channel partners in the US, UK, Europe and Asia Pacific. The Polar logo and pixelated strip are copyright Polar Instruments Ltd.

Share


Suggested Items

Fadi Deek Discusses Mentor’s New Power Integrity eBook

04/22/2018 | Andy Shaughnessy, Design007 Magazine
At DesignCon 2018, I ran into Mentor’s Fadi Deek, the author of both of Mentor’s I-Connect007 eBooks: the newest, "The Printed Circuit Designer’s Guide to Power Integrity by Example," and their first book, "The Printed Circuit Designer’s Guide to Signal Integrity by Example." We sat down and discussed how the idea for the books came about, as well as some of the power integrity challenges facing PCB designers and engineers.

Mentor’s HyperLynx Automates SERDES Channel Design

04/09/2018 | Andy Shaughnessy, Design007 Magazine
Mentor recently released the newest version of its HyperLynx signal integrity software. This version may be the first SI tool in the industry to fully automate SERDES design channel validation. I spoke recently with Chuck Ferry, product marketing manager with Mentor, about the new HyperLynx and some of the new serial link design capabilities that customers have been demanding.

Julie Ellis: TTM’s Interface Between Designer and Fabricator

04/04/2018 | Barry Matties, Publisher, I-Connect007
As a field application engineer for TTM, Julie Ellis sees the problems that can occur between circuit board designers and manufacturers. Barry Matties spoke with Julie at the AltiumLive event in Munich about the age-old problem of throwing designs “over the wall,” the trend towards HDI, and what advice she would give new designers.



Copyright © 2018 I-Connect007. All rights reserved.