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IPC—The Association Connecting Electronics Industries will be holding a two-day, design-focused IPC professional development courses on July 26–27, 2017, in Chicago, Illinois.
Day 1 will focus on EMI control, including grounding, power distribution, and board stack-up, among others, and will be led by Rick Hartley. This workshop is all about up-front design. Getting the design right to prevent having to throw costly band-aids on the product to stop the hemorrhaging of electric and magnetic fields. The knowledge gained from this workshop can significantly reduce product development time and cost, as well as improve product performance.
The next day’s course will be on design challenges, including fine pitch BGA design, and best design practices to produce a more manufacturable board. To be given by Susy Webb, the first section of this two-in-one class utilizes illustrations and real-world examples to explore the complexities of using fine pitch BGAs in designs. The second section of this class discusses best practices that, when incorporated by the designer, will help make fabrication and assembly easier and therefore lower the time and cost needed for a quality board.
For more information, or to register for these courses, click here.
I-Connect007 Editorial Team
During the Design Forum at IPC APEX EXPO 2018, Jan Pedersen, senior technical advisor for the PCB broker Elmatica, gave a presentation on CircuitData. The language is designed to help facilitate other design data transfer formats such as Gerber, ODB++, and IPC-2581. Jan spoke with Managing Editor Andy Shaughnessy and Contributing Technical Editor Happy Holden about how this open language works with the existing data formats, as well as the need to eliminate paper documents from design process, and how the industry can help shape this open-source language.
Andy Shaughnessy, Design007 Magazine
During DesignCon 2018, Andy Shaughnessy sat down for an interview with Martin Cotton, director of OEM projects for Ventec. Martin was a PCB designer for years, so he has experience on both sides of the desk. They discussed Ventec’s reasons for coming to DesignCon, their expansion into low-loss materials, and Ventec’s new I-Connect007 book, The Printed Circuit Designer’s Guide to Thermal Management with Insulated Metal Substrates.
Real Time with...IPC
During IPC APEX EXPO 2018, the IPC-2581 Consortium held a demo of this open-source data transfer standard, attracting numerous designers, fabricators and assembly providers. Jim Pierce of Axiom Electronics and Bob Miklosey of Aegis Software sat down to discuss the demo and their involvement with the consortium. Axiom now charges more for designs submitted in the Gerber format.