Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
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Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBsKoh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
April 30, 2024 | Koh YoungEstimated reading time: 1 minute
Koh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center. The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. Koh Young is proud to be the exclusive gala sponsor of the 74th ECTC.
The technical program includes papers covering leading edge developments and technical innovations across the packaging spectrum, including topics like assembly and manufacturing technology, advanced packaging, as well as emerging technologies in both poster and presentation formats. The panel, plenary, special sessions, and EPS seminar provide conference participants with an opportunity to gain insights and perspectives from industry leaders.
The ECTC Exhibition complements the strength of the ECTC technical program with an opportunity for engineers and decision makers to collaborate with Koh Young and other packaging companies. “With our market-leading, AI-powered complement of inspection machines designed to reduce waste with zero-defect production via automated process control and autonomous optimization, we have the expertise and solutions to help manufacturers improve their processes,” remarked Brent Fischthal, Head of Global Marketing at Koh Young. “We will be in booth 724 during the exhibit hours and available to discuss your advanced packaging and wafer level inspection and application challenges.”
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