-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
iNEMI Publishes Four Roadmap Topics
April 4, 2024 | iNEMIEstimated reading time: 2 minutes
The International Electronics Manufacturing Initiative (iNEMI) announces the availability of the first roadmap topics in the new iNEMI Roadmap format. Printed circuit boards, sustainable electronics, smart manufacturing, and mmWave materials and test are now available online.
“The in-depth content on these topics is intended to help companies align technology progress with their respective commercial interests and to support high-volume manufacturing,” says Francis Mullany, iNEMI Director of Roadmapping. “The new format provides a more structured, accessible view of the roadmap that is easily updated based on market movements and technology innovations. And, of course, the roadmap continues to chart the future evolution of electronics manufacturing in terms of application drivers, technical needs, gaps, and technical solutions over a 10-year horizon to help guide R&D investment decisions by industry as well as public research programs and government agencies.”
Initial Topics Include Technologies Critical to Complex Integrated Systems
This initial wave of roadmap topics focuses on key technologies and cross-cutting topics critical to complex integrated systems (CIS), as discussed in a recent iNEMI/IPC whitepaper “Complex Integrated Systems: The Future of Electronics Manufacturing." The scope of each topic area now available is described below.
Printed Circuit Boards — Printed circuit boards (PCBs) are a fundamental element of a vast range of electronic products. The PCB manufacturing ecosystem must continuously evolve and react to “technology blurring” with respect to substrates. The initial iNEMI Roadmap discussion of this topic covers a broad spectrum: high-speed PCBs and substrates; test, inspection and measurement; and environmental issues. Other topics currently under preparation include microwave and mmWave PCBs, laminate-based semiconductor packaging and PCB design.
Sustainable Electronics — Sustainability in the design, manufacture, use and end-of-life handling of electronics systems is an increasingly important consideration across the entire electronics manufacturing ecosystem. The iNEMI Roadmap currently focuses on the full scope of circularity and on key materials used. A new reporting format gathers information on sustainability hot-spot issues and roadmaps mitigating technologies on a per-substance basis.
Smart Manufacturing — The term “smart manufacturing” encompasses the adoption of informed, intelligent, automated manufacturing processes at factory, enterprise, and ecosystem levels for increased flexibility, resiliency and efficiency. The initial release of roadmap content looks at the central topic of data flow architecture and at the increasingly important issue of security of smart manufacturing systems and data.
mmWave Materials and Test — As part of the 5G/6G MAESTRO project, work on this topic was supported by the National Institute of Standards and Technology’s (NIST’s) Office of Advanced Manufacturing. It considers the challenges posed by the operation of electronics at mmWave frequencies and higher. The focus is on the materials and their characterization and electrical test, primarily for PCBs and packaging substrates.
Publication Schedule
In the coming months, the iNEMI Roadmap will:
Provide qualitative market driver assessments and quantitative requirements for multiple application areas
Map technology gaps and potential solution approaches for other critical technology topics such as board assembly, complex integrated systems, modelling and design
Build a dynamic online presence for the iNEMI Roadmap, collaborating closely with other industry roadmaps
Suggested Items
Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing
05/16/2024 | FoxconnSiemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.
TRI Opens New Manufacturing Facility
05/16/2024 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, announced that it has opened a state-of-the-art R&D and manufacturing facility.
SEMICON West 2024 to Spotlight U.S. Chip Industry Investments, Supply Chain Resilience, Talent, and Global Growth and Innovation
05/15/2024 | SEMISEMICON West 2024 will gather industry experts and leaders July 11-13 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues.
Using AI to Redefine Productivity
05/15/2024 | Nolan Johnson, SMT007 MagazinePlato Systems, a machine perception company spun out of Stanford University, employs AI and video data to analyze and optimize the human component in manufacturing. Initially focused on semiconductors, Plato Systems has expanded into EMS manufacturing. Co-founder and CEO Amin Arbabian, along with product advisor Anders Holden and head of growth Luis Vidal, discuss their approach to changeover optimization and its impact on productivity in the industry. They’ve also included customer Raj Vora in the conversation.
SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO
05/15/2024 | BUSINESS WIRESMTC Corporation, a leading North American provider of electronics manufacturing services, is pleased to announce the appointment of Mike Buseman as President & Chief Executive Officer, effective May 13, 2024.