-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Register Now for Eric Bogatin’s Transmission Lines 101 Sept. 29-30
September 16, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute
Professor Eric Bogatin of the University of Colorado-Boulder is doing a rare live class, online, covering transmission line fundamentals. The 1.5-day Transmission Lines 101 will take place September 29-30. The tagline for the class is “Never be intimidated by transmission lines again!”
Eric is known for taking complicated signal integrity issues and breaking them down into manageable bites that everyone can understand. The course will help PCB designers and design engineers understand how signals propagate on transmission lines, how to design transmission lines using a 2D field solver, and how to interpret TDR measurements. This will be applied to both single-ended and differential transmission lines.
This course is for any engineer or technician who wants to understand what characteristic impedance really means, how to think about signals on transmission lines, and how to effectively use commercial tools to design transmission lines and interpret TDR measurements. If your job involves transmission lines, this course will bring you from zero to mastering transmission lines.
The content is presented at a level suitable for mechanical engineers, test engineers, manufacturing engineers, materials engineers, and anyone who designs circuit boards for data rates above about 10 Mbps.
The class takes place on Thursday afternoon, September 29, and all day Friday, September 30. For more information, or to register, click here.
Suggested Items
Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
05/03/2024 | PRNewswireSynopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/03/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Real Time with… IPC APEX EXPO 2024: Software Solutions for Circuit Board Challenges
05/03/2024 | Real Time with...IPC APEX EXPONolan Johnson speaks with Will Webb from Aster Technologies about their software solutions for design teams, manufacturing, test engineers, and process engineers. Aster's software addresses the increasing complexities of circuit boards and the need for alternative testing methods.
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.