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In this week’s top five: a high profile surprise merger between Autodesk and Altium, which had been in the works, resolved this week; financial news from fabs and assemblers around the globe is reporting strong bookings and sales as the industry bounces back from pandemic-related shutdowns; component demands continue to exert pull pressures on the semiconductor suppliers, keeping the market (overly?) competitive pricewise. The tiles are indeed being stirred. Which pieces will you be dealt?
Today’s data-thirsty world is looking forward to the next-generation communication systems beyond 5G, the promise of massive connectivity to the internet with extreme capacity, coverage, reliability, and ultra-low latency, enabling a wide range of new services made possible through innovative and resilient technologies. The exponential growth in data speed and networking has introduced numerous design and analysis challenges across a system design. Design teams are challenged to deliver new, differentiated products faster and more efficiently, despite the ever-growing complexity of silicon, package, board, and software for many complex applications in the hyperscale computing, automotive, mobile, aerospace, and defense markets.
Size constraints, functional requirements, and environmental factors can make selecting PCB thickness difficult. Here we will examine best practices for choosing board thickness that results in quality, highly functional...
When I first read the poem many decades ago, it immediately struck me with its simple yet profound wisdom. Since that fortunate discovery, the poem has informed often my conscious thinking. I'm sure it will for you as...
Mel Brooks may have something to teach us about going "ludicrous speed" in getting our designs to the finish line. John Watson...
