Tim’s Takeaways: Conquering Layers of Challenges in PCB Stackups

January 25, 2021 | Tim Haag, First Page Sage

When he first started laying out printed circuit boards many years ago, Tim was working for a computer systems manufacturer whose PCB designs were all multilayer boards. While there were a great many things that I learned during my time working there, it also fostered one bad habit; He became accustomed to relying on being able to use multiple layers for routing instead of planning a more efficient layout. Here, he breaks it all down.

Yes, 2020 was a challenge. It's during those times that we can learn some significant lessons if we allow them.



Dana on Data: Factory 4.0 NPI Data Transfer Improvements

January 14, 2021 | Dana Korf, Korf Consultancy LLC

The recently released IPC Connected Factory Initiative scope is similar to other Factory 4.0 models with the same glaring omission: They all seems to assume that the incoming design data can’t be used as-is and must be reviewed...

Foundations of the Future: Scholarships, Awards and Student Opportunities

January 6, 2021 | IPC Education Foundation, IPC

There was no better way to end 2020 than by making a positive impact in deserving students and educators’ lives. We can help students to invest in their future and reward the accomplishments of those who are hardworking and...

Figure It Out: Closing the Gap Between College and Industry with PCEA

December 23, 2020 | Dugan Karnazes, Velocity Research

What is the solution for the knowledge gap between industry requirements and college education? Dugan Karnazes explores what PCEA is doing to inspire, educate and unite PCB...

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