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Planes are essential in today’s high-speed multilayer PCBs. Unfortunately, the number of power supplies required is increasing dramatically with IC complexity. Now, accounting for them all has become a real challenge. The high number of supplies generally leads to higher layer count substrates. In the past, we used to have more signal routing layers than planes; the opposite is now the case when the majority of stackup layers are reserved for power distribution. Although this increases the cost, it may be a godsend because it provides segregation of critical signals to avoid crosstalk and reduces radiation.
At electronica 2018, John McMillan, digital marketing program manager-Electronic Board Systems, and Mark Laing, business development manager-Valor Division of Mentor, a Siemens business, discuss new tools for PCB design verification, as well as design for manufacturing (DFM) and design for testing (DFT).
One of the most frustrating mismatches with alternative through-hole parts occurs when the land pattern matches, but the pin size is off. If hole sizes are too tight, pins may not fit through the holes, or if they do go into the...
This month’s spotlight is the Silicon Valley Chapter. We held our fall quarterly meeting on October 25, 2018, at none other than Levi’s Stadium in Santa Clara, California—yes, the site of Super Bowl 50 and the...
As noted in Part 3 of this series, a broad range of discrete passive component elements are candidates for embedding, but the decision to embed these component elements within the multilayer circuit structure must be made early in the...
In Medical PCB Design, Innovation Never Stops, a conversation with Kenneth MacCallum
Dock Brown on Succeeding at Failure Analysis, a conversation with Dock Brown
What You Do Matters, by Tim Haag
New Grad Designs PCBs for Smart Baby Beds, a conversation with Tamara Jovanovic
Internet of Body: The Next Big Thing for Medical, a conversation with Titu Botos
