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A Tribute to Dieter Bergman

May 4, 2021 | David Bergman, IPC

In 1962, while at Philco Ford, Dieter became the company’s official representative to the IPC. Dieter tag-teamed with his friend and co-worker Gerald Ginsberg on the development of a prolific run of technical publications including a multilayer design standard and the massive binder known as the IPC-D-330 IPC Design Guide. For his standards contributions, Dieter received the IPC President’s Award in 1968, the same year he assumed chairmanship of the IPC Design Committee.

Show & Tell Magazine Now Available on Demand

May 4, 2021 | I-Connect007 Editorial Team

IPC APEX EXPO 2021 is in the history books now. But as the paperboys used to say in the 1930s, you can still “read all about it” in Real Time With… IPC APEX EXPO 2021 Show & Tell Magazine! It’s all right here in one convenient publication: interviews with award winners, coverage of keynote speeches, show notes from our technical staff, thoughts from IPC Emerging Engineers, and much more





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COLUMNS:

Testing Todd: A Point of Order—Do Not Just Rearrange the Pencils!

April 28, 2021 | Todd Kolmodin, Gardien Services, USA

In our concentration on continuous improvement, we should look in to the order of things. Efficiency comes from streamlining processes, effective training, and the ability to monitor success through KPIs and feedback on deliverables....

Exciting news! This column marks the launch of a series of columns diving into semi-additive PCB (SAP) manufacturing processes. We will explore topics ranging from SWaP benefits, signal integrity benefits, materials characterization,...

Foundations of the Future: Emerging Engineers Benefit from Mentorship

April 21, 2021 | IPC Education Foundation, IPC

The IPC Emerging Engineer Program just graduated its first members in 2020, finishing up the first batch of the 3-year program. While the Emerging Engineer Program was traditionally created for early-career professionals, IPC and the...

The Simulation Issue Featuring:

  • Barry Olney’s High-Speed Simulation Primer, Interview with Barry Olney
  • Bridging the Simulation Tool Divide, Interview with Todd Westerhoff
  • Simulation Stackup and Signal Integrity, by Martyn Gaudion
  • Why We Simulate, by Bill Hargin
  • Alternatives to Simulation, by Dan Beeker
  • Using Simulation to Assist With PCB Design, by John Coonrod
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